Hello,
we have following problem:
We are using ceramic chips on FR4 due to the temperature cycles we use
during burn in (-40 to +85°C) the chips are sheared of the board. I know
that there is the possibility to solder column interposers onto the chips.
But doing this we would loose the warranty on the chips which we don't
want. We need a soldering solution between chip and board. Is there a
company that offer mezzanie ype of boards with a material that takes the
CTE? A solution converting the BGA to a PGA is not possible due to
vibration in the application.
Any other solution??
Thanks a lot
Timo
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------