Fellow TechNetters:
What is a rule of thumb for Thermal Heat Sink Spreader solder fillet
coverage. During x-ray imaging I have observed varying coverage with
respect to the PCB copper
pad foot print and the heat sink. This ranges from 30 to 90% coverage.
I am unable to state the associated thickness of this coverage except
for gray scale keeping all setting alike. IPC does have a guideline
for PTH Vertical fill of 50% for Powers and 75% for signals.
Can anyone share their experience with me.
Victor,
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