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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 25 Jun 2004 09:42:36 -0700 |
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Hi Tom:
Can they be blind vias? They will not suck down any solder, just an opption.
Regards,
Ramon
-----Original Message-----
From: Tom Parkinson [mailto:[log in to unmask]]
Sent: Friday, June 25, 2004 11:14 AM
To: [log in to unmask]
Subject: [TN] VIA in Pad
We're a CM. One of our customers is asking us to build a board assembly
that will be using BGAs with VIAs in pads. They are in the design stages at
this point, and we have some concerns with having a Via in the middle of a
BGA pad. Anyone have suggestions and/or experience with this??
Thanks
Tom Parkinson - Quality System Manager - CIT
WinTronics, Inc.
Ph: 724-981-5770 Ext. 235
Fax: 724-981-1772
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