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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 24 Jun 2004 08:00:57 -0500 |
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Hi Karl,
Especially immediately after Peak Temp and during the Cool Down slope. For
this reason, nitrogen inertion in the cooling zone can be critical to
achieve shiny joints. I found this critical for reflowing bumps on BGAs and
Wafers.
Shean Dalton
Austin American Technology
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of SUBSCRIBE Technet
Karl Loh
Sent: Thursday, June 24, 2004 6:43 AM
To: [log in to unmask]
Subject: [TN] Oxidation of reflowed solder
Hello,
During reflow, flux de-oxidizes solder. After reflow, does the solder re-
oxidize? If so, how long does it take?
Thanks
Karl
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