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Tue, 1 Jun 2004 10:34:29 -0500 |
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Hi Victor,
We have never had a problem finding cracks/fractures in cross-sectioned
solder joints as long as the sample prep was good. We use a colloidal
silica solution (0.05 micron)on a soft nap cloth for a final polish. This is
after a 6 and 1 micron diamond polish on a harder cloth. All the
metallographic suppliers, Allied, Buehler, Struers, Leco, etc. stock a
colloidal silica solution with a pH of 9 or better for this type of
polishing. I would be glad to go into more detail or even cross-section a
couple of samples for you if you would like.
Thanks,
Wade McFaddin
Nextek Inc.
Analytical Laboratory
(256)772-1995 ext.1064
-----Original Message-----
From: Victor G. Hernandez [mailto:[log in to unmask]]
Sent: Tuesday, June 01, 2004 9:43 AM
To: [log in to unmask]
Subject: [TN] SnPb Etchant and LF enchants
Fellow TechNetters:
Can anyone shares their experience with SnPb solder etchant, I want
to decorate the solder fillet to search for
potentials fractures after a Post reliability environment. SnPb is soft
and I don't want to overlook artifacts due to
smearing during the final polishing process. Once upon a time in a
previous life a co-peer instructed me to used a
Buehler Final Masterpolish with a pH of 9.
Victor,
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