Good afternoon,
I have a question on the thermal characteristics of Entek OSP. We have a
flex circuit which requires OSP as the finish. We intend to do the OSP
operation but then we have to thermally bond a rigid stiffener on the flex.
OSP will see pressure and a temperature of approx. 350 F for 1 hour. Will
the OSP handle this. Thanks for your help. Regards Steve Kelly
PFC Flexible Circuits Limited
Ph: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433
E-Mail: [log in to unmask]
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