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June 2004

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TechNet <[log in to unmask]>
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Date:
Fri, 25 Jun 2004 15:13:07 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Steve Kelly <[log in to unmask]>
Subject:
OSP Question
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From:
Steve Kelly <[log in to unmask]>
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Good afternoon,

I have a question on the thermal characteristics of Entek OSP. We have a
flex circuit which requires OSP as the finish. We intend to do the OSP
operation but then we have to thermally bond a rigid stiffener on the flex.
OSP will see pressure and a temperature of approx. 350 F for 1 hour. Will
the OSP handle this. Thanks for your help. Regards Steve Kelly



PFC Flexible Circuits Limited

Ph: (416) 750-8433

Fax: (416) 750-0016

Cell: (416) 577-8433

E-Mail: [log in to unmask]




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