DESIGNERCOUNCIL Archives

June 2004

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DesignerCouncil <[log in to unmask]>
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Date:
Fri, 25 Jun 2004 11:14:01 -0400
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"(Designers Council Forum)" <[log in to unmask]>, Tom Parkinson <[log in to unmask]>
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Subject:
VIA in Pad
From:
Tom Parkinson <[log in to unmask]>
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Organization:
WinTronics, Inc.
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We're a CM.  One of our customers is asking us to build a board assembly
that will be using BGAs with VIAs in pads.  They are in the design stages at
this point, and we have some concerns with having a Via in the middle of a
BGA pad.  Anyone have suggestions and/or experience with this??

Thanks


Tom Parkinson - Quality System Manager - CIT
WinTronics, Inc.
Ph: 724-981-5770 Ext. 235
Fax: 724-981-1772
 

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