This sounds more like a board fab issue to me.  I would carefully
investigate the microetch process before HASL that your fabricator did.

In a past life we ran into big problems like this.  Anytime you see the HASL
solder pulling back from the copper pad, you know there is a problem at the
copper/solder interface.  They should have done a decent microetch to prep
the copper for the HASL process.

Good Luck,
Hal

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jason W. Gregory
Sent: Wednesday, May 12, 2004 8:27 AM
To: [log in to unmask]
Subject: [TN] Reflow problem


Hello all,

After running a single pass of a double sided SMT board, the bottom side
solder from HASL is spiking and pooling up in the middle of the pad (from
gravity), forcing us to wick and prep the side prior to running the bottom.
You can actually see the copper showing lightly around the edges of the
pads. We are running vapor phase reflow and the solder paste used is SN96
(high temp soldering). Has anyone seen this? I am leaning towards profile
issues. However, I wanted to see if anyone has seen this and if it was fab
issues or not.


TIA,

Jason Gregory
Manufacturing Engineer
LaBarge Inc. --- Houston
(281)207-1464
(281)207-1435 fax
(832)724-0076 cell
[log in to unmask]
http://www.labarge.com

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