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May 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 11 May 2004 16:35:32 -0400
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Linda -

I do not havce an hard reference, but years ago we did the Method 208
test for 8hrs to simulate a 3 year shelf life when stored at ambient
conditions - 70F/50 RH. I believe the contract was NASA.



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Linda Woody [mailto:[log in to unmask]] 
Sent: Tuesday, May 11, 2004 1:35 PM
To: [log in to unmask]
Subject: [TN] Steam aging equivalent shelf life extension


I'm trying to find out what the equivalent shelf life extension for
solderability is when using steam aging. Does an 8hr. steam aging
correspond to some # of months expectation for good solderability. Is
there a formula for hrs. steam aging vs. months of solderability?

Any/all info. is appreciated.

Linda Woody
Lockheed Martin
Missiles and Fire Control Systems

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