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Date: | Fri, 7 May 2004 09:35:41 -0700 |
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Have you considered having a step-stencil made for this particular
application?
Ahne Oosterhof,
A-Laser, Inc
Call me at: 503-641-9428
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dacia Super
Sent: Friday, May 07, 2004 8:19
To: [log in to unmask]
Subject: [TN] Stencil Needed for BGA Fine Pitch Parts
All -
Please reference the following link for the exact specifications related to
the part we are dealing with - specifically pages 98 and 99
http://download.micron.com/pdf/datasheets/dram/ddr2/256Mb_x4x8x16_DDR2_B.pdf
I have a handful of parts that I need to reball; however, we don't have any
in-house micro BGA stencils that will accommodate this component. In the
middle of the underside of the part, there is a ridge that prevents a
stencil from laying flat against the surface - this ridge extends up to 8
mils beyond the base of the package. So, I will need a special stencil.
Does anyone out there have any experience with these components? Any ideas
or suggestions? Potentially a lead where I can have a stencil purchased
that will conform to the underside of this part?
I'm still new to the BGA game - so forgive me. If there is additional
information needed, just let me know.
I appreciate the help.
Thanks.
Dacia Leanne Schoolfield
[log in to unmask]
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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