Hi Dacia!!

You don't need a stencil. You can re-ball the devices with a BGA pre-form. Go
to:

 http://www.winslowautomation.com/prodlist.asp?record=1

Up will pop a window, and then type in 84 into the box where it asks for ball
count. Then click on search. You will get three records found. The second one
is the pre-form for your BGA.

You can reball these puppies without a stencil. Search through the Winslow
Automation site, and you will find a link that shows step-by-step instructions
of how to use their pre-forms.

-Steve Gregory-


> All -
>
> Please reference the following link for the exact specifications related to
> the part we are dealing with - specifically pages 98 and 99
> http://download.micron.com/pdf/datasheets/dram/ddr2/256Mb_x4x8x16_DDR2_B.pdf
>
>
> I have a handful of parts that I need to reball; however, we don't have any
> in-house micro BGA stencils that will accommodate this component.  In the
> middle of the underside of the part, there is a ridge that prevents a
> stencil from laying flat against the surface - this ridge extends up to 8
> mils beyond the base of the package.  So, I will need a special stencil.
>
> Does anyone out there have any experience with these components?  Any ideas
> or suggestions?  Potentially a lead where I can have a stencil purchased
> that will conform to the underside of this part?
>
>
> I'm still new to the BGA game - so forgive me.  If there is additional
> information needed, just let me know.
>
> I appreciate the help.
>
> Thanks.
>
> Dacia Leanne Schoolfield
> [log in to unmask]
>


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