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May 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 May 2004 09:50:04 -0400
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ENIG is IPC-4552
Electrolytics:  IPC-6012 Table 3-2 has some requirements, but AMS-2422
and ASTM-B-488 are the controlling documents.



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: David Harman [mailto:[log in to unmask]] 
Sent: Tuesday, May 04, 2004 8:52 PM
To: [log in to unmask]
Subject: [TN] GOld plating standard over NI on PCB.


I am looking to specify a minimum gold thickness on my pads on my PCB.
Is there a standard that I can quote for gold thickness and porosity to
avoid any NI from migrating up through the gold and causing NI oxide? 
 
 
 
David Harman
 

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