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May 2004

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 May 2004 12:51:39 -0400
Content-Type:
text/plain
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text/plain (134 lines)
 It is an accelerated test for marine environments.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Douthit
> Sent: Tuesday, May 04, 2004 12:56 PM
> To: [log in to unmask]
> Subject: Re: [TN] Corrosion resistance of Ni/Au plating
>
> Eric,
>
> Just exactly how does this "salt fog" test correspond to your
> possible end use environments?
>
> David A. Douthit
> Manager
> LoCan LLC
>
> Eric CHRISTISON wrote:
>
> >Ok, thanks for the info.
> >
> >No clear cut answers but I guess PCB finish doesn't make that much
> >difference.
> >
> >Can anyone tell me if lead free solders perform better in corrosive
> >environments?
> >
> >Thanks,
> >
> >Eric Christison Msc
> >Mechanical Engineer
> >Consumer & Micro Group - Imaging Division STMicroelectronics
> >33 Pinkhill
> >Edinburgh
> >EH12 7BF
> >UK
> >
> >Tel:     +44 (0) 131 336 6165
> >Fax:    +44 (0) 131 336 6001
> >
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
> >Sent: Tuesday, May 04, 2004 3:48 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] Corrosion resistance of Ni/Au plating
> >
> >
> >Hi folks! Some additional data - we (e.g. the industry
> technoweinees)
> >are much too quick to jump to the conclusion that we have a galvanic
> >compatibility problem when using either immersion gold or immersion
> >silver pwb finishes. Rockwell Collins published a paper at
> the 2003 IPC
> >Fall meeting which demonstrated that the galvanic impact was
> secondary
> >to a standard corrosion reaction in a salt fog test - i.e.
> our tin/lead
> >test samples which were in a galvanically happy couple situation
> >underwent healthy corrosion. The galvanic compatibility
> tables are very
> >important and should not be ignored but they also can be misleading
> >depending on the environment/configuration. Collins has a follow up
> >immersion silver, immersion gold, immersion tin, and
> tin/lead galvanic
> >corrosion study in progress and will report the results
> sometime in early 2005.
> >
> >Dave
> >
> >
> >
> >                      Vladimir Igoshev
> >                      <[log in to unmask]        To:
> [log in to unmask]
> >                      >                        cc:
> >                      Sent by: TechNet         Subject:  Re:
> [TN] Corrosion
> >resistance of Ni/Au plating
> >                      <[log in to unmask]>
> >
> >
> >                      05/04/2004 09:19
> >                      AM
> >                      Please respond to
> >                      "TechNet E-Mail
> >                      Forum."; Please
> >                      respond to
> >                      Vladimir Igoshev
> >
> >
> >
> >
> >
> >
> >
> >Rudy,
> >
> >It's not supposed to be any Au layer left after re-flow. It
> desolves in
> >solder.
> >
> >Vladimir
> >Sent from my Blackberry Wireless
> >Vladimir Igoshev, 519-888-7465 ext.5283
> >
> >
> >-----Original Message-----
> >From: Rudy Sedlak <[log in to unmask]>
> >To: [log in to unmask] <[log in to unmask]>
> >Sent: Tue May 04 10:05:27 2004
> >Subject: Re: [TN] Corrosion resistance of Ni/Au plating
> >
> >Central to this issue is the question of whether the Gold was
> >completely covered by the Tin/Lead solder.
> >
> >I suspect it was not, and if it was not, this would set up a
> galvanic
> >cell, which would accelerate the attack on the Tin Lead dramatically.
> >
> >Rudy Sedlak
> >RD Chemical Company
> >

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