Just a quick check of a few websites led me to this @ http://www.amkor.com/services/Green_Packaging/index.cfm

"The most common of the solder alloys proposed for Pb free assemblies are ternary combinations of tin, silver and copper. These alloys typically contain 3 - 4% silver, 0.5 - 1.0% copper, with the remainder being tin. With melting ranges just below 220°C, versus eutectic tin/lead at 183°C, packages must be able to survive much higher temperatures during reflow assembly processing. Despite these more severe temperature exposures, the ternary Sn/Ag/Cu alloys are being used successfully in production. As a result, they are a natural choice to be used for solder balls on area array packages. In 2000 Amkor announced adoption of the Sn/4.0Ag/0.5Cu alloy as our standard material. This was done after completing board level reliability testing, characterization of the ball attach process, and cooperative efforts with industry consortiums. Since this announcement, Amkor has qualified numerous packages with this Pb free alloy. In 2001, Amkor also started a program to characterize and qua
 lify the Sn/3.0Ag/0.5Cu alloy."

Seems from what Amkor is saying, their product is already leadfree???

Steve Mikell
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