TECHNET Archives

May 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Hans Shin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 27 May 2004 14:22:35 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (39 lines)
Hi Paul,

Are you referring to bulk solder or solder on boards?  If you're not picky,
SEM/EDX or XRF can give you tin/lead composition.  For more detailed
analysis such as solder purity, I would recommend atomic absorption
spectrophotometry (AAS).

Hans Shin
Pacific Testing Laboratories, Inc.
www.pacifictesting.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stolar, Paul W
Sent: Thursday, May 27, 2004 1:49 PM
To: [log in to unmask]
Subject: [TN] Lab


Does anyone know of an analytical lab where they can do analysis of
solder down to %0.1 ?

XRF should work, but I am not picky.

Paul Stolar
Materials/Reliability Engineer
Manufacturing Reliability Lead Engineer
Baker Atlas
713-625-5376

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2