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May 2004

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 May 2004 10:19:07 -0400
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Rudy,

It's not supposed to be any Au layer left after re-flow. It desolves in solder.

Vladimir
Sent from my Blackberry Wireless 
Vladimir Igoshev, 519-888-7465 ext.5283


-----Original Message-----
From: Rudy Sedlak <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue May 04 10:05:27 2004
Subject: Re: [TN] Corrosion resistance of Ni/Au plating

Central to this issue is the question of whether the Gold was completely
covered by the Tin/Lead solder.

I suspect it was not, and if it was not, this would set up a galvanic cell,
which would accelerate the attack on the Tin Lead dramatically.

Rudy Sedlak
RD Chemical Company

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