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May 2004

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 May 2004 17:36:00 -0700
Content-Type:
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text/plain (101 lines)
Tom,

The IPC currently has a task group (5-32b SIR testing committee) that is
in the process
of not only designing test boards but also making major
revisions/additions to testing methods.

They can be reached at: [log in to unmask]

David A. Douthit
Manager
LoCan LLC



Tom Gervascio wrote:

>Thanks good idea. I've gone so far as adding flourescent agents (without effecting the paste and flux)  to the paste and flux to improve detection.
>
>Tom Gervascio
>Senior Process Engineer
>Sparton Electronics
>(352) 540-4040
>
>
>
>>>>[log in to unmask] 05/20/04 08:48AM >>>
>>>>
>>>>
>        Hi Tom:
>                  Just and idea, how about gluing all the components on one corner only. Do not use solder paste and deball the BGAs. Or perhaps the  BGAs can be set up with stand offs and glued on just on corner and not be deballed. Spray the board with flux, run it through the reflow oven and clean it. Break off the glue and check under parts and between  leads.
>        Good luck
>        Ramon
>
>-----Original Message-----
>From: Tom Gervascio [mailto:[log in to unmask]]
>Sent: Thursday, May 20, 2004 8:30 AM
>To: [log in to unmask]
>Subject: [TN] Cleaning test boards
>
>
>I am looking for an "off the shelf" test board and components that could be used for evaluating the effectiveness of cleaning process.
>
> In the past, I've ordered dummy boards with mixtures of microBGA, Pin Grid Arrays, Quad Flat Packs and SMT connectors representing parts for which we have had cleaning problems. Sometimes I've tried to bond glass slides and cover plates to quickly look at the ability to get under different standoff height versus package size (yes I realize this has different surface energies than actual parts- but it's a tradeoff of actually trying to remove soldered parts to look under them for ionic and visual residues).  But his is difficult and time consuming to get the boards and parts and I was trying to get ideas. Also this doesn't include test patterns to check for electromigration or S&IR effects.
>
>Are there any standard test vehicles or designs that people have developed and be willing to share?
>
>Thanks
>
>
>
>Tom Gervascio
>Senior Process Engineer
>Sparton Electronics
>(352) 540-4040
>
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