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May 2004

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Subject:
From:
Mike McMonagle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 May 2004 11:30:29 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (143 lines)
Zestron makes it:
http://www.zestron.com/usa/produkte/zubehoer/flux/flux001.php

Mike

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Thursday, May 20, 2004 11:29 AM
To: [log in to unmask]
Subject: Re: [TN] Cleaning test boards


        Tom:
                There is a solution kit that when dropped on the surface
of a board containing flux will change the color of the flux  to blue.
I am not able to find it at this time. Perhaps someone in the forum
knows.
        Regards,
        Ramon


-----Original Message-----
From: Tom Gervascio [mailto:[log in to unmask]]
Sent: Thursday, May 20, 2004 10:29 AM
To: [log in to unmask]
Subject: Re: [TN] Cleaning test boards


Thanks good idea. I've gone so far as adding flourescent agents (without
effecting the paste and flux)  to the paste and flux to improve
detection.

Tom Gervascio
Senior Process Engineer
Sparton Electronics
(352) 540-4040

>>> [log in to unmask] 05/20/04 08:48AM >>>
        Hi Tom:
                  Just and idea, how about gluing all the components on
one corner only. Do not use solder paste and deball the BGAs. Or perhaps
the  BGAs can be set up with stand offs and glued on just on corner and
not be deballed. Spray the board with flux, run it through the reflow
oven and clean it. Break off the glue and check under parts and between
leads.
        Good luck
        Ramon

-----Original Message-----
From: Tom Gervascio [mailto:[log in to unmask]]
Sent: Thursday, May 20, 2004 8:30 AM
To: [log in to unmask]
Subject: [TN] Cleaning test boards


I am looking for an "off the shelf" test board and components that could
be used for evaluating the effectiveness of cleaning process.

 In the past, I've ordered dummy boards with mixtures of microBGA, Pin
Grid Arrays, Quad Flat Packs and SMT connectors representing parts for
which we have had cleaning problems. Sometimes I've tried to bond glass
slides and cover plates to quickly look at the ability to get under
different standoff height versus package size (yes I realize this has
different surface energies than actual parts- but it's a tradeoff of
actually trying to remove soldered parts to look under them for ionic
and visual residues).  But his is difficult and time consuming to get
the boards and parts and I was trying to get ideas. Also this doesn't
include test patterns to check for electromigration or S&IR effects.

Are there any standard test vehicles or designs that people have
developed and be willing to share?

Thanks



Tom Gervascio
Senior Process Engineer
Sparton Electronics
(352) 540-4040

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