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May 2004

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Subject:
Re: Corrosion resistance of Ni/Au plating
From:
Rudy Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 May 2004 10:05:27 EDT
Content-Type:
text/plain
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text/plain (19 lines) 
Central to this issue is the question of whether the Gold was completely
covered by the Tin/Lead solder.

I suspect it was not, and if it was not, this would set up a galvanic cell,
which would accelerate the attack on the Tin Lead dramatically.

Rudy Sedlak
RD Chemical Company

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