I am looking for an "off the shelf" test board and components that could be used for evaluating the effectiveness of cleaning process.

 In the past, I've ordered dummy boards with mixtures of microBGA, Pin Grid Arrays, Quad Flat Packs and SMT connectors representing parts for which we have had cleaning problems. Sometimes I've tried to bond glass slides and cover plates to quickly look at the ability to get under different standoff height versus package size (yes I realize this has different surface energies than actual parts- but it's a tradeoff of actually trying to remove soldered parts to look under them for ionic and visual residues).  But his is difficult and time consuming to get the boards and parts and I was trying to get ideas. Also this doesn't include test patterns to check for electromigration or S&IR effects. 

Are there any standard test vehicles or designs that people have developed and be willing to share?

Thanks



Tom Gervascio
Senior Process Engineer
Sparton Electronics
(352) 540-4040

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