Doug,
I am not aware of any. I am working on a project to qualify new solder masks
and via fill processes. One part of that is using the tape test on the
coupons which also have the via holes. I am trying to develop a
pre-conditioning step above and beyond what is called out in 3.7.2 of
IPC-SM-840C, before re-doing the tape test. So far I can't get any failures
in a reasonable time frame to be an accepted test. I will keep you posted.
Dewey

-----Original Message-----
From: Douglas O. Pauls [mailto:[log in to unmask]]
Sent: Monday, May 17, 2004 12:30 PM
To: [log in to unmask]
Subject: [TN] Another Solder mask question


Good day all,
Seems the day for solder mask questions, so I will throw one out.

Are any of you aware of any published papers that work to establish a
correlation between the results of a tape test (e.g. IPC TM 650 method
2.4.28.1) and the adhesion of solder mask features (e.g. solder mask dams)?

Doug Pauls

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