TECHNET Archives

May 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Rudy Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 May 2004 14:37:57 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
Bob:

Removing soldermask chemically is slow, tedious, difficult, but not
impossible.  (At least if it is cured... if it is not cured, it is easy)

The implications of this are that selective removal (cured) would be nearly
impossible...

Rudy Sedlak
RD Chemical Company

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2