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May 2004

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From:
Alexandra Curtis <[log in to unmask]>
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TechNet E-Mail Forum.
Date:
Fri, 14 May 2004 14:17:38 -0500
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Don't miss out on this opportunity to submit an abstract or educational course proposal on the HOTEST topic around. The IPC/JEDEC 6th International Conference on Lead Free Electronic Components and Assemblies in Singapore August 18-20, 2004. 

Papers are sought in all areas, including: 
* Policy - European Lead Ban status 
* EMS Industry - on the front line of the change.
* Component issues (Passives and Actives)
* Design issues
* Environmental health and safety effects (on the alternatives too!)
* PCB issues
* OEM/Consumer demands/voluntary elimination dates 
* Recycling options 
* Substitution - New commercially available alloys/conductive adhesives/ease of replacement
* Cost issues
* Reliability evaluations, e.g., temperature cycling data, tin whiskers evaluation
* Roadblocks to implementation
* Finishes issues - Organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc.
* Lead-free and other product sectors (automotive, aerospace, etc.)

 
The International Lead Free Conference offers time slots between 30-45 minutes long. Some papers may be grouped together in a forum or panel discussion. To submit an abstract, please include an abstract of 200-300 words along with a brief biography via e-mail to [log in to unmask]

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