hi,

i noticed that no one replied the last time.  all i can say is that when i was at ncr we used 30 u-inch of gold over nickel for our card edge connector fingers.  eventually, one of our operations decided that 3 u-inch was enough; that one made me nervous.  as far as i know, 30 u-inch never gave a problem.  i realize you have a somewhat different application, but the justification of 30 u-inch was that it was sufficient to be porosity free.

phil

-----Original Message-----
From: David Harman [mailto:[log in to unmask]]
Sent: Wednesday, May 12, 2004 12:33 PM
To: [log in to unmask]
Subject: [TN] AU on pads


Hello again group and I want to thank you for helping me with past
questions.  I have another question regarding the thickness of gold that
should be applied to PCBA pads.  We have standard gold over
nickel/copper pads.  The pads are not used for any insertion but used as
a contact point for board interconnection via a zebra strip. 
 
What is a recommended gold thickness over nickel to prevent nickel
oxidation caused by migrating nickel? 
 
Thank you for your help again.
 
Thanks
David Harman
 

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