Fred
This is an issue best left to the Assembly house since they are the ones
building it.
In the past I have always provide my stencil data as a 1 to 1 and let
manufacturing define the requirements.
Only in special circumstances have I created an stencil geometry that was
defined as necessary from MFG.

Paul




Paul Brionez <mailto:[log in to unmask]>
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PCB Designer - CID
PH: 847-673-2718 x1394
FAX: 847-673-9789

MPC Products Corporation
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Skokie, IL USA    <http://www.mpcproducts.com>




-----Original Message-----
From: Fred Dark [mailto:[log in to unmask]]
Sent: Thursday, May 13, 2004 12:43 PM
To: [log in to unmask]
Subject: [DC] Solder paste stencil


Hello all, I would like to know as far as stencils go, do you size down
your pad in your gerber file for your paste mask or do you leave it up to
the stencil manufacture, Assembly house who might be doing the assembly to
say how much to size it down... I was never asked and just assumed that you
generate the stencil pad sizes the same size and let the stencil house size
pads down as required... Can someone clarify this for me...?

Regard's, Fred Dark Jr.

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