Joe,
The Swiss are doing this. They are in the middle of a BIG study.
Bev Christian
Research in Motion
-----Original Message-----
From: Joe Zaccari [mailto:[log in to unmask]]
Sent: May 7, 2004 2:18 PM
To: [log in to unmask]
Subject: [LF] RE: [LF] Re: [LF] reliability study on SAC with various
PCB and component finish combinations
Good point, has anyone done any "decelerated" thermal cycle tests to see
what happens when the lead-free joint actually has time to creep? There was
a paper at CARTS this year that talked about ramp rates, dwell times and
temp range as applied to lead free joints. The implication was that the
standard tests might not be adequate. And isn't a less accelerated
temperature cycle more realistic for some real world applications?
Best regards,
Joe Zaccari
Military Programs Manager
Corfin Industries LLC
[log in to unmask]
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Friday, May 07, 2004 8:52 AM
To: [log in to unmask]
Subject: [LF] Re: [LF] reliability study on SAC with various PCB and
component finish combinations
It seems, that all the consortia efforts [NEMI, HDPUG, TURI] equate the
performance of LF-solders in accelerated reliability tests with product
solder
joint reliability. General reliability pronouncements are made based on
relative
performance in, often rather severe, accelerated thermal cycling tests;
without
even stating any caveats about this huge leap.
Unfortunately, this does a great disservice to the industry, since without
any acceleration models these conclusions cannot be drawn--and this
particularly
in the light of the knowledge that LF-solders creep slower than
SnPb-solders,
which has a huge effect on the outcome of accelerated tests.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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