Bill,

Paper Phenolic boards have been successfully HASL'd lead-free in Germany with
solder and air knife temperatures of 265C and immersion times ~ 1 sec.

That was with the Ni-modified Sn-Cu eutectic alloy which has a melting point
of 227C.   And to achieve that result you need to be using one of the HASL
machine that have  the capability of holding the solder bath and air knife close
to that temperature during processing.

Whether your XPC boards could cope with that thermal excursion would have to
be determined experimentally.

You could perhaps get an idea of whether it is anywhere near the ballpark by
asking your PCB supplier about the process parameters he uses for your boards
with tin-lead HASL.

Keith Sweatman
Nihon Superior Co., Ltd.

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