Hi Cemco-Peter, Tyco-Hilty and IPC LF Listservers,

I have been striving to stay off list to do other LF study and work yet
this is an exciting proposition for technical information. As you know I
still have a NIST duty to negotiate / reclaim and a few others.

First of all this report that Bob linked us to now and in the past, is done
quite well.

The European Tyco group did a great job of giving the baseline for SnPb HAL
or HASL yet I guess were not able to do comparatives for all the other
metallurgies. I mean sometimes studies just are not complete yet can still
be done really well.

So I hope you can all negotiate and can find the time to update this fine
report by Belgium, Tyco

Yours in Engineering, Dave

Y i Engr, MA/NY DDave



On Fri, 28 May 2004 15:06:34 +0100, Pete Lymn <[log in to unmask]> wrote:

>Thanks Robert,
>I read the paper with interest but note that fused lead free solders were
>not compared.  Lead free solders can be applied using adapted HASL machines
>and result in more uniform surface and hole coatings.  The lighter alloys
>require less energy to level resulting in a much tighter thickness range
>with improved 'minimum' thicknesses and significantly lower 'maximum'
>thicknesses.  Hole clearing is more uniform with less closedown.  If you or
>anyone else would like us to tin some sample to compare please do not
>hesitate to contact me.  We have SnCu+Ni permanently available and will be
>conducting trials with two SAC alloys in the next few weeks...
>Peter.

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