Carl:
We published some info on lead free press-fit components on our lead free
website at:
http://www.tycoelectronics.com/environment/leadfree/techdata.stm
I am not surprised about an increase in force.  For our testing, we found
that compliant pin (eye of the needle and action pin style) had a general
increase in insertion force of about 8% when compared to bright tin/lead
finishes.  The biggest cause for this increase is the conversion from a
bright finish (smooth and harder) to a matte finish.  The matte finish has
been dictated by many customers due to whisker concerns.  Tyco's testing has
also shown that in general there is about a 21% increase in retention force,
which ultimately leads to increased reliability in the joint.

Our testing of compliant pins includes testing at the boundaries of the hole
tolerances for various pins and board finishes.  If the holes were in
tolerance, then we saw no evidence of fractured barrels or cracking in the
devices.  If the plating is out of tolerance, then some issues can arise.
The most common fault is when the nickel thickness is too large on board
finishes that use nickel; this can lead to cracking of the nickel.

If you have further questions, please contact me directly.

Cheers,

Bob Hilty
Tyco Electronics

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Carlr Ray
Sent: Thursday, May 27, 2004 8:43 AM
To: [log in to unmask]
Subject: [LF] Lead Free design guides for press fit


Hi All,
 Does anyone have any information for design rules for lead free
compliant pin operations? We encountered an issue yesterday where during
our press fit operations our equipment keep reaching force insertion
limits. After we spent hours we finally reached the conclusion that the
components we were using were lead free. The vender changed the plating
without changing the part number or notifying us of the change. So we
now have mixed inventory and are in the process of sorting this
material.
 This brought up major concerns with processing of compliant pin
operations. Quality concerns are with the current design if we can no
longer get these components with lead plating then how will the current
design and process react to the lead free components. Fractured barrels,
cracked or damaged devices and PCB stress are concerns and will impact
field reliability.
 Any information would be greatly appreciated.


===============================
Carl Ray
Manufacturing Engineering Manager
Plant 520 (Kenosha Operations)
Pleasent Prairie, WI 53158
Desk: TBD
Fax: TBD
Cell: 256-990-1990
[log in to unmask]
===============================

----------------------------------------------------------------------------
---Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
----------------------------------------------------------------------------
---

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------