Hi All,
 Does anyone have any information for design rules for lead free
compliant pin operations? We encountered an issue yesterday where during
our press fit operations our equipment keep reaching force insertion
limits. After we spent hours we finally reached the conclusion that the
components we were using were lead free. The vender changed the plating
without changing the part number or notifying us of the change. So we
now have mixed inventory and are in the process of sorting this
material.
 This brought up major concerns with processing of compliant pin
operations. Quality concerns are with the current design if we can no
longer get these components with lead plating then how will the current
design and process react to the lead free components. Fractured barrels,
cracked or damaged devices and PCB stress are concerns and will impact
field reliability.
 Any information would be greatly appreciated.


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Carl Ray
Manufacturing Engineering Manager
Plant 520 (Kenosha Operations)
Pleasent Prairie, WI 53158
Desk: TBD
Fax: TBD
Cell: 256-990-1990
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