Hello Moss,
See:
http://materials.open.ac.uk/srg/srg5.htm

for an example of tin pest on a Sn0.5Cu lab specimen (after > 1 year at -18C)
.  The researchers, Professor Bill Plumbridge and his colleagues have
published on this in the Journal of Electronic Materials and the TMS'  monthly
magazine: JOM.

With best regards,
Jean-Paul

In a message dated 5/25/2004 8:40:57 PM Eastern Standard Time,
[log in to unmask] writes:
In reference to Howard H. Manko's book "Solders and Soldering" I'm just
interested in learning from the metallugist fraternity out there his description of
"Tin Pest"
"When cooled to low temperatures, pure tin transforms from a white metallic
material into a grey amorphous powder. In the past this transformation was
called "tin pest", because tin articles for no explainable reason crumbled into
dust." (13.2degC)

The paragraph continues to describe detrimental properties of tin - but can
anyone comment for Sn0.7Cu or any high tin containing alloy if this is of
concern.

_______________________________________
J-P. Clech
EPSI Inc.
P. O. Box 1522, Montclair, NJ 07042, USA
tel.: +1 (973)746-3796; fax: +1 (973)655-0815
Web: http://jpclech.com

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