Hi all

In reference to Howard H. Manko's book "Solders and Soldering" I'm just interested in learning from the metallugist fraternity out there his description of "Tin Pest"
"When cooled to low temperatures, pure tin transforms from a white metallic material into a grey amorphous powder. In the past this transformation was called "tin pest", because tin articles for no explainable reason crumbled into dust." (13.2degC)

The paragraph continues to describe detrimental properties of tin - but can anyone comment for Sn0.7Cu or any high tin containing alloy if this is of concern.

Also has anyone Phase Diagrams for the SnCu and SAC alloys that show the "recommended alloy temperature during wetting" as presented in Manko's book (Fig 3.8) as opposed to the rule of thumb approx 40degC above liquidus?


All information/references appreciated,
Thanks in advance
Moss

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