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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 24 May 2004 10:55:10 EDT |
Content-Type: | text/plain |
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Hi Jeo,
The best that can be done at this time, is to follow IPC-9701, but to
increase the temperature dwells to at least 30 minutes. However, in the current
absence of an acceleration model for any of the LF-solders, even these test
results cannot be extreapolated to a life cycle reliabillity prediction.
Sorry,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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