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Date: | Wed, 19 May 2004 22:35:13 +0200 |
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During some solderpaste trials we've noticed that a paste (3% silver SAC
alloy) showed less tombstoning than another paste (SAC with 4% silver).
The pastes are from a different brand.
I tend to think that the lower silver content reduces tombstoning and we are
going to do more trials to verify this.
But, question to you all; is there any other data out there that confirmes
my findings?
Regards
Jowan Iven
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