During some solderpaste trials we've noticed that a paste  (3% silver SAC
alloy) showed less tombstoning than another paste (SAC with 4% silver).
The pastes are from a different brand.
I tend to think that the lower silver content reduces tombstoning and we are
going to do more trials to verify this.
But, question to you all;  is there any other data out there that confirmes
my findings?



Regards

Jowan Iven



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