That is not necessarily true. Within each web site of major US and Japan
companies are sections dealing with environment which are notably ponderous
and detailed but not to the revelation of sources and technology.
The measure is there to show the effort made and the progress to date and
the timetable for final compliance.
I suppose that you are correct in terms of the measure of reliability
comparing old to new materials and process, but I think we all agree that
there is rarely an apple to apple comparison, since component sizes, board
density and number of contacts have changed rapidly in the front runner
products of these big corporations. The measure is in the final
performance, yield, and customer perception of quality. The new bells and
whistles tend to overshadow, the occasional bad board or warranty repair.
The bottom line is the cost to maintain the product integrity versus the
sales and profit.
James P. Canner
Senior Applications Engineer
Murata Electronics North America
1900 W. College Ave
State College PA 16801-2799
(814)-237-1431 x 2032
[log in to unmask]
Leo Higgins
<Leo_Higgins@ASAT To: [log in to unmask]
.COM> cc:
Sent by: Leadfree Subject: Re: [LF] Reliability information on SAC
<[log in to unmask]
>
05/19/2004 12:17
PM
Please respond to
"(Leadfree
Electronics
Assembly Forum)";
Please respond to
Leo Higgins
There are digital cameras and other consumer electronics at Best Buy, and
elsewhere, largely from Japan, that are now displaying stickers that state
that the products are RoHS and WEEE compliant. But these products may not
be
considered highly stressed products and the camera manufacturers are surely
not making the little bit of data they have available to the public.
Regards,
Leo
-----Original Message-----
From: Lee Whiteman [mailto:[log in to unmask]]
Sent: Tuesday, May 18, 2004 4:32 PM
To: [log in to unmask]
Subject: Re: Reliability information on SAC
Jean-Paul,
I agree with you 100%. Prior to releasing hardware to the field, one
should perform some level of reliability testing to assure that the
product has some level of integrity.
My concern is that with the volume of test vehicles built with Lead Free
alloys (specifically SnAgCu), has anyone "pulled the trigger" and made
the conversion over to Lead Free solder alloys in the commercial,
telecommunications, and / or aerospace markets. Most test vehicles have
daisy chain components, not functional electrical components. I'm not
only interested about the solder joint reliability, but also the
electrical reliability of components.
My gut tells me that progress has been made, but there is little field
data to illustrate how well these products performed versus their SnPb
counterparts. Did they experience more field failures than for SnPb? Did
their components survive? What was the root cause of failure? Stuff
like that.
Granted, SnPb has 50 years of field experience. We have a little more
than 2 years to convert to Lead Free.
Lee Whiteman
Senior Manufacturing Engineer
American Competitiveness Institute
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x208
Fax: (610) 362-1290
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