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May 2004

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 19 May 2004 09:30:49 -0500
Content-Type:
text/plain
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text/plain (85 lines)
Merely selecting a higher Tg material will not be sufficient to address
this issue. Experience has shown that outgassing of the laminate can
vary significantly and should be an additional consideration. Edward
Kelley/Cookson presented a paper at APEX 04' that addresses this issue
in some depth. Check those proceedings.

Rich Kraszewski 
Advanced Manufacturing Engineer - KEDS
Phone:  260.925.8919
 
 
 


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of McCall,Doug
Sent: Wednesday, May 19, 2004 2:02 AM
To: [log in to unmask]
Subject: [LF] Pb-free and laminate Tg requirements


Hi,

What is the general thinking on the glas transistion temp (Tg) for FR4
being used for Pb-free PCBAs.  I guess that the 'standard' is 140 deg-C
and is it sensible (and required) to go for a higher Tg??  Is it a good
idea to use a higher spec laminate??

Any thoughts will be very interesting.

Thanks,
> Douglas I McCall
> Printed Circuit Board Assembly Engineer,
>
> /// /// ///  BOC EDWARDS
H   BOC Edwards, 15 Marshall Road, Eastbourne, East Sussex, England,
BN22
9BA
> *  +44 (0)1323 501147
*    +44(0)1323 509824
*+44 (0)7785 247 685
> *  mailto:[log in to unmask]
www.bocedwards.com




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