IPC-PE-740A is a good document that provides defect root cause for fab and assembly.  For a more in-depth explanation of issues, there is a book - "Printed Circuits Handbook" by Coombs that has some good information on PCB process technology - I think it is 5th edition.  Also for a good professional opinion it maybe wise to use a qualified lab - I recommend Robison Labs in Indianapolis.



Jeffrey Bush
Director, Quality Assurance and Technical Support

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-----Original Message-----
From: Juan T. Marugán [mailto:[log in to unmask]] 
Sent: Monday, May 10, 2004 5:04 PM
To: [log in to unmask]
Subject: [TN] Microsection. Need for help


Hi folks,

I'd like to know where could I find a guide to help me to interpret the results of some microsections. These were performed in an external lab, but its conclusions didn't match with the opinion of the specialist of our customer. Cross-sections where performed in a multilayer board. The defects found are very clear (some inner layers are separated from barrels) but the conflict we have is what was the root cause.

I will appreciate any kind of help. Thank you in advance.

Juan

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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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