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April 2004

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Subject:
From:
Prasad AN <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Apr 2004 16:42:23 +0530
Content-Type:
text/plain
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text/plain (132 lines)
Hi Liew

The problem could be because of delamination of BGA happened in reflow
process. The delamination maybe due to BGA exposed to moisture for long
time.


Thanks with Warm regards

A.N.Prasad
Sr. Engineer - Projects


88A, Electronics City,
Hosur road,
Bangalore - 560100
+91-80-8520022 Tel
+91-80-8521022 Fax

[Flextronics Internal Use]


-----Original Message-----
From: Liew, Sen Joon [mailto:[log in to unmask]]
Sent: Monday, April 12, 2004 9:40 AM
Subject: Re: BGA soldering issue

Hi, David,

The finish on the board was HASL. Is it totally unacceptable for prototypes.
The pitch of the BGA is
1.0mm.

Thanks.

Best regards,
SJ Liew
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Douthit
Sent: Wednesday, April 07, 2004 11:26 AM
To: [log in to unmask]
Subject: Re: [TN] BGA soldering issue


What kind of finish was on the PCB (ENIG, Tin, Silver, OSP)?
What was the thermal profile during manufacturing?
How moisture sensitive was the part?
What were the storage condtions for the part and the PCB?
Is there part and/or board warpage?

This is a fair start at solving this issue.

David A. Douthit
Manager
LoCan LLC

Liew, Sen Joon wrote:

>Dear Technetters,
>
>We encountered BGA chip having intermitten contact issue in our prototypes.
When we pressed hard on the BGA chip, the prototype worked ok. We need
advice
>on how to tackle this issue from prototype building's point of view. What
measures should be taken to make sure "no contact issue" during prototype
building.
>
>Your advice is very much appreciated. Thanks in advance.
>
>Best regards,
>SJ Liew
>
>
>
>
>
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