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April 2004

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Subject:
From:
David Hoover <[log in to unmask]>
Reply To:
David Hoover <[log in to unmask]>
Date:
Sat, 10 Apr 2004 09:37:47 -0700
Content-Type:
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text/plain (85 lines)
Technetians,

I too have been wrestling with one of these "bad boys" in a "Lead-Free"
flavor from Bourns.
It also is a .5 mm pitch but with only has 8 pads (2 rows of 4).
http://www.bourns.com/2/pdfs/CAY10.pdf
The outer corner pads are larger than the inside four (?). The issue is it
leaves the pad-to-pad
spacing at 5.86 mils and the OEMs wants a soldermask web. As specified in
the component
spec sheet, this leaves us with a 3 mil soldermask web and a 1.43 mil (S/M)
clearance on
each side to the SMT pads. This may pose to be a challenge in high volume
production.

This little component is gaining much popularity. : /
I was just wondering if anybody has tried reducing the pad sizes slightly to
allow for a more
manufacturable set of parameters?

Cheers,

David Hoover

http://home.earthlink.net/~dhoovy
PS-Check out the Zycon Demolition pictures in the HADKIN Tribute Page. : /

----- Original Message -----
From: "Meier, Siegfried" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, April 05, 2004 9:45 PM
Subject: [TN] Chip Resistor Arrays


Dear TechNetters,

we are using more and more chip resistor arrays. They are available in
concave and two convex (scalloped edge, square edge) types. The concave one
is some expensive and less disposable, but I heard that it is easier to
solder giving better quality.

Any opinions and informations comparing the different types (concave,
convex) are welcome.

Thank you in advance for your help.

Siegfried Meier
Dipl.-Ing.

Entwicklung selbstfahrende Erntemaschinen
Müller-Elektronik GmbH u. Co.
Franz-Kleine-Str. 18
D-33154 Salzkotten

Tel: +49 5258 9834-70
Fax: +49 5258 9834-94
email:  [log in to unmask]
Internet: http://www.mueller-elektronik.de



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