Tom,
7628 prepreg is relatively dry as far as resin content (less than 50%)
To properly fill between traces you will need higher resin content materials.
What should be used depends on copper thickness, technology, process, etc.
I would suggest as a starting point you probably could use 1080 prepregs to do the copper side bonding (min 2 sheets req'd)
But until you have developed a solid knowledge of material stackups, I would suggest you ask this question of your favorite Fabricator.
If you what to discuss, feel free to call or send me your number off-line.
Hope it helps,
FNK
Frank N Kimmey CID+
Principle PCB Designer
Powerwave Technologies
EDH 916-941-3159
FAX 916-941-3195
CEL 916-804-2491
-----Original Message-----
From: Tom Burek [mailto:[log in to unmask]]
Sent: Thursday, April 08, 2004 1:34 PM
To: [log in to unmask]
Subject: [TN] PCB Laminate/Stackup question
Hello Technetters,
I have a question about layer stack-ups. Some time ago a respected
contributor to this forum presented us with some valuable information in
the form of a specification he developed. In this specification, under
the title, MASTER DRAWING NOTES 1.0 Laminate, Core and Prepreg Material,
section 1.9 states,"There shall be no 7628 glass style prepreg used facing copper. If
required, single ply or multi-ply 7628 core material may be used. If used
as prepreg, 7628 only may be used between two other more resin rich glass
styles."
My question is what does this mean to the stack-up? Why should you not use
7628 facing copper? Does it have to do with the amount of resin not
present in 7628 and may not bond to the copper sufficiently? What should
be used? and Why?
I hope this question is not too imposing.
Thank you in advance.
Tom Burek, CID+
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