Design and Process Implementation for Embedded Passives Technology
April 14-15, 2004 at IPC's Headquarters in Northbrook, IL

Open panel discussion April 16, 2004 at Motorola, Inc.

Instructors: Dennis Fritz, MacDermid, Inc.; John (Jack) Fisher, Interconnect Technology Analysis, Inc.; Richard Snogren, Coretec Denver, Inc; .Dieter Bergman IPC; John Andresakis, Oak-Mitsui, Inc. and Michael Fitts, Mentor Graphics

With the explosive growth of wireless technology and high speed/frequency circuits, implementing embedded passives component technology has become vital to electronics manufacturing. 
Saving assembly real estate is no longer just an important benefit since performance often requires that resistor and capacitor devices be close to the power I/Os of the semiconductor.  Embedded passive technology fulfills this requirement.

This two day workshop will cover the how and why of conditions in the materials and assembly processes that impact product performance. The difference between integrated and embedded passive components will be explained. 

This course will provide understanding and know-how for those involved in design and manufacturing process implementation. Risk assessment and trade-offs of embedded passive technology and its integral involvement in the interconnect substrate will be also covered.

IPC thanks Motorola, Inc. for opening up their facility for an open panel discussion with engineers from Motorola and other industry representatives who are using embedded passive component technology. Get a first-hand insight into how the implementation of embedded passives technology has improved performance and reduced the costs of their electronic products.
 
Registration fee for the two-day workshop and admission to the open panel discussion at Motorola: 
$595 IPC/Designers Council Member                       $895 Non-member 
 
Open panel discussion at Motorola only: $150 Member and Non-member

To register or for more information, go to http://www.ipc.org/calendar/DesignforEP_41404/DesignforEP_041404.htm.

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