It makes a lot of sense. The connections are not only in the barrel, though the barrel needs to be only 75% filled. The top pad and the bottom pad contribute to the lead attachment. For BGAs is a different story.
Regards,
Ramon
> -----Original Message-----
> From: Werner Engelmaier [SMTP:[log in to unmask]]
> Sent: Wednesday, March 31, 2004 3:39 PM
> To: [log in to unmask]
> Subject: Re: [TN] Voids in Thru-Hole Solder Joints
>
> Hi Carrie,
> 1. The causes of voids in SJs are many--moisture, flux/paste volatiles, wave
> process, etc.
> 2. Voids in a PTH-SJ typically have no significant reliability consequence
> unless they contain chemicals that attack the surrounding metal. Mechanically,
> the component lead provides excellent connectivity retundancy.
> 3. Ideally, there are no voids--to my knowledge thare is no spec.
>
> Regards,
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL 32174 USA
> Phone: 386-437-8747, Fax: 386-437-8737
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
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