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Subject:	Re: BGAs Repair Using solder paste or flux per pitch
From:	"Misner, Bruce" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 7 Apr 2004 10:00:27 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (52 lines)

There is no requirement either way. While I generally use paste flux only, I
believe the general past tech-net consensus is that both methods work well.
Adding solderpaste, while more difficult, should result in larger package
standoff which will improve reliability.

Regards,
Bruce Misner

-----Original Message-----
From: Reuven ROKAH [mailto:[log in to unmask]]
Sent: Wednesday, April 07, 2004 3:27 AM
To: [log in to unmask]
Subject: [TN] BGAs Repair Using solder paste or flux per pitch


Hi All , Jack,

Pls inform if there is IPC list, recommendation / requirement of using
solder paste or flux paste in accordance with the BGAs pitch or technology
(ceramic. plastic package) in the rework process.
If yes, pls detail.

Thanks and happy and peaceful eastern holiday.

Best  Regards

Reuven  ROKAH

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