Is this a plastic or ceramic BGA?  Different Packages can have different
problems.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Liew, Sen Joon [SMTP:[log in to unmask]]
        Sent:   Tuesday, April 06, 2004 9:57 PM
        To:     [log in to unmask]
        Subject:        [TN] BGA soldering issue

        Dear Technetters,

        We encountered BGA chip having intermitten contact issue in our
prototypes. When we pressed hard on the BGA chip, the prototype worked ok.
We need advice
        on how to tackle this issue from prototype building's point of view.
What measures should be taken to make sure "no contact issue" during
prototype building.

        Your advice is very much appreciated. Thanks in advance.

        Best regards,
        SJ Liew





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