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Subject:	Re: BGA soldering issue
From:	Susan Mansilla <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 7 Apr 2004 07:08:16 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Recently we did a failure analysis for a company who thought they had a
similar problem only to find it was not the BGA solder joints, but wedge voids in
vias.  The vias will also be open and shut with flexing of the board.  Just one
more thing to check.

Susan Mansilla
Robisan Lab

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