Hi, David,
Thanks for your response. There is no board warpage. Actually, the board is quite small (150mm x 100mm FR4). We
do not know the thermal profile during manufacturing as the prototype was outsourced for manufacturing.
The board worked ok in Singapore, and then we sent over to USA for further evaluation, the "contact issue" began to
happen. Could it be due to delivery issue from Singapore to USA.
We need some advice/guideline from every technetter so that we can request our outsourcing partner to follow. Thanks
in advance for your response.
Best regards,
SJ Liew
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Douthit
Sent: Wednesday, April 07, 2004 11:26 AM
To: [log in to unmask]
Subject: Re: [TN] BGA soldering issue
What kind of finish was on the PCB (ENIG, Tin, Silver, OSP)?
What was the thermal profile during manufacturing?
How moisture sensitive was the part?
What were the storage condtions for the part and the PCB?
Is there part and/or board warpage?
This is a fair start at solving this issue.
David A. Douthit
Manager
LoCan LLC
Liew, Sen Joon wrote:
>Dear Technetters,
>
>We encountered BGA chip having intermitten contact issue in our prototypes. When we pressed hard on the BGA chip, the prototype worked ok. We need advice
>on how to tackle this issue from prototype building's point of view. What measures should be taken to make sure "no contact issue" during prototype building.
>
>Your advice is very much appreciated. Thanks in advance.
>
>Best regards,
>SJ Liew
>
>
>
>
>
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