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April 2004

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Subject:
From:
Susan Mansilla <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Apr 2004 09:20:58 EDT
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Franklin
Just one additional comment to add to Doug's

IPC-TM-650, Method 2.6.3 is titled Moisture and Insulation Resistance,
Printed Boards

This method has be used - originally as part of DOD-200 test methods - for a
very long time 30+ years to test printed wiring boards.  It is the cycling of
temperature while keeping the humidity very high.  It was proposed in order to
force moisture through conformal coating, solder mask and further into a
multilayer board to evaluate the "cleanliness" of internal layers as well as the
surface.

Susan Mansilla

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