Jana,
I applaud your statement. I believe that a lot of what we do is just this
--- difficult, but not impossible. Different surface finishes being the
scapegoat here......sometimes, although we don't like it, we have go a
little above and beyond in order to achieve a workable result. If we spend
a little "up-front" time doing the homework, then we can do just about
anything. ENIG has been around a while and although we all would like high
availability, low cost, easy reworkability, relative flatness
characteristics, etc. we just make do with we got and just have to think
about it a little more.
Jason Gregory
Manufacturing Engineer
LaBarge Inc. --- Houston
(281)207-1464
(281)207-1435 fax
(832)724-0076 cell
[log in to unmask]
http://www.labarge.com
Doug Corbett
<douglas.a.corbett@ To: [log in to unmask]
L-3COM.COM> cc:
Sent by: TechNet Subject: Re: [TN] Black Pad Prevalence
<[log in to unmask]>
04/05/2004 02:03 PM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
douglas.a.corbett
I would echo that sentiment. In my brief experience with ENIG (and black
pad), it seems to come when there are already smaller/less significant
problems with the ENIG plating or other processes (i.e. everything pretty
much goes south at the same time...:)
-----Original Message-----
From: Jana Carraway [mailto:[log in to unmask]]
Sent: Monday, April 05, 2004 11:54 AM
To: [log in to unmask]
Subject: Re: [TN] Black Pad Prevalence
Importance: Low
I'm not an expert in ENIG, but having spent 20+ years in this industry,
experience tells me that the success, or lack thereof, of any process is
directly related to the company and people running the process. I do not
think ENIG is much different from my experiences installing, running, and
troubleshooting imaging processes; whether it is DuPont, Dynachem (past
history), or Hitachi (more current history), each resist has positives and
negatives, distinct process windows, and the success is more often
dependent
on the ability of a facility to optimize for the product or technology.
The key to the successful operation of any process is understanding the
variables and controlling those variables for optimum process and product
performance.
I am uncomfortable with generalizations comdemning any given technology,
particularly one that is as widely used as ENIG. I know there are
companies
successfully producing and utilizing ENIG surfaces. We have used it for
over 4 years with very, very few issues and no line down situations due to
the surface finish or black pad. I suspect that, as an industry, we have
not learned all the critical variables or interactions with ENIG, thus, we
have not fully optimized the process.
Just my opinion,
Jana Carraway
Lake Oswego, Oregon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeffrey Bush
Sent: Monday, March 29, 2004 5:15 AM
To: [log in to unmask]
Subject: Re: [TN] Black Pad Prevalence
ENIG processes are costly to maintain and this finish if not the
preferred solution for soldering planarity. The Nickel deposition
process requires a good deal of attention and the main issue is the
process going south is the lack of work being processed through it. The
cost of ownership of the ENIG outweighs the benefits sharply and both
tin and silver exist as economic alternatives to gold and do not have
the disadvantages which go beyond the black pad condition. Silver
appears to be the most effective alternative as it is more forgiving for
time delays between thermal excursions, but many assemblers have adapted
their process to also run tin effectively, which has the lowest overall
cost impact per unit.
Stay away from ENIG and evaluate tin and/or silver.
Jeffrey Bush
Director, Quality Assurance and Technical Support
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302-1890
Tel. 802.257.4571.21 Fax. 802.257.0011
[log in to unmask]
http://www.vtcircuits.com
-----Original Message-----
From: Paul Truit [mailto:[log in to unmask]]
Sent: Saturday, March 27, 2004 10:03 AM
To: [log in to unmask]
Subject: [TN] Black Pad Prevalence
I have searched the archives and have found lot's of good info but
nothing in regard to the prevalence or the statistical occurrences of
this event.
I have run tens of thousands of ENIG boards and I haven't observed this
defect but I am concerned enough to ask. Is this a board fabricator
controllable issue that has been minimized?
Have you observed this phenomenon? How often will this occur? Is
immersion silver the better way to go to assure the reliability and
quality of the products?
--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH 44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask]
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