Joe/Alcon:
- IMHO it was not, and is not, the intent of IPC standards to limit the use
of any technology that will produce a conforming product (see paragraph 1.1
Purpose of 001).
- In a former life I had intimate contact with the development of Mil-Stds.
and with quality assurance aspects of DOD procurements. Re the MIL-STDs;
WS-6536, DOD-STD-2000 and Mil-Std-2000 all limited the use of alternative flux to
tinning of solid wire, sealed components, terminals and epoxy bodied parts. By
the time we wrote Mil-Std-2000A and Mil-Std-2000B (unfortunately never issued)
the light of day had begun to break over DOD. Paragraph 4.6.3 (Use of nonrosin
fluxes) of 2000A in discussing the use of non-rosin flux states in
subparagraph b. " Material is used to solder printed wiring assemblies and data
demonstrating compliance with the testing requirements of Appendix A is available for
review." The intent of DOD in using that phrase in both 2000A and 2000B was to
allow the use of nonrosin flux by responsible manufacturers.
- Regarding HF-1189 and similar formulations. In the aforementioned former
life I recommended the use of 1189, and approved the use of similar formulations
on hardware procured by DOD. After testing 1189 to evaluate the corrosive
characteristics of any residue and found no problems I recommended it for use in
amplifiers internal to oxygen masks and flight helmets for USN aircrews.
- Helloooo: the message is, the responsible use of nonrosin flux is accepted
practice not only within DOD but within Class 3 products for the private
sector.
Regards, Jim Moffitt

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