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April 2004

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Subject:
From:
"Douglas O. Pauls" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Apr 2004 15:08:25 -0500
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Kenny,
Are you by chance trying to use your reflow profile to cure the glue at the
same time?  If so, bad practice.  Most glue cures run in the 2-4C/min
gradient.  Most reflows are in the 20-30C/min gradient.  Curing too fast
can skin over the adhesive, giving the swiss cheese effect, and which can
also entrap flux from your solder paste in the process.

Doug Pauls

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